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MB97R8050 Datasheet(PDF) 10 Page - RAMXEED LIMITED |
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MB97R8050 Datasheet(HTML) 10 Page - RAMXEED LIMITED |
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10 / 13 page ![]() MB97R8050 10 DS411-00005-4v0-E RECOMMENDED ASSEMBLY CONDITIONS (WAFER) The MB97R8050 is recommended to be mounted in the following condition to maintain the data retention characteristics of the FeRAM memory when the chip is mounted. - Mounting temperature of 175 C or lower, and 120 minutes or shorter when applied at high temperature, or - Mounting temperature of 200 C or lower, and 60 seconds or shorter when applied at high temperature +175 +25 120 +200 +25 60 Time [min] Time [s] |
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