4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage

-0.5

6

V

IIK

Input diode current

VI < -0.5V or VI > VCC +

0.5V

±20

mA

IOK

Output diode current

VO < -0.5V or VO > VCC +

0.5V

±50

mA

IO

Output source or sink current per output pin

VO > -0.5V or VO < VCC +

0.5V

±50

mA

ICC or IGND (2)

VCC or ground current

±100

mA

Tstg

Maximum storage temperature

-65

150

°C

(1)

Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating

and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not

implied.

(2)

For up to 4 outputs per device, add ±25mA for each additional output.

4.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

TA

Temperature Range

-55

125

°C

VCC (1)

Supply Voltage Range

AC Types

1.5

5.5

V

ACT Types

4.5

5.5

V

VI, VO

DC Input or Output Voltage

0

VCC

V

dt/dv

Input Rise and Fall Slew Rate

1.5V to 3V

AC Types

50

ns

3.6V to 5.5V

AC Types

20

ns

4.5V to 5.5V

ACT Types

10

ns

(1)

Unless otherwise specified, all voltages are referenced to ground.

4.3 Thermal Information

THERMAL METRIC(1)

D (SOIC)

PW (TSSOP) BQB (WQFN)

UNIT

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

119.9(2)

139.5

98.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

—

74.8

94.6

°C/W

RθJB

Junction-to-board thermal resistance

—

97.7

67.7

°C/W

ΨJT

Junction-to-top characterization parameter

—

17.8

15.6

°C/W

ΨJB

Junction-to-board characterization parameter

—

96.6

67.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

45.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

note.

(2)

θJA is measured with the component mounted on an evaluation PC board in free air.

CD54AC257, CD74AC257, CD54ACT257, CD74ACT257, CD74ACT258

SCHS248C – NOVEMBER 1998 – REVISED APRIL 2025

www.ti.com

4

Submit Document Feedback

Copyright © 2025 Texas Instruments Incorporated

Product Folder Links: CD54AC257 CD74AC257 CD54ACT257 CD74ACT257 CD74ACT258