Reference

Generator

LVDS

GND

OUTN [0..5]

OUTP [0..5]

LVDS

OUTN [6..11]

OUTP [6..11]

GND

VCC

VCC VCC VCC

VCC

VCC

VCC

VAC_REF0

INP0

INN0

INP1

INN1

EN

200 kW

200 kW

VAC_REF1

6mmx 6mm

40 pinQFN (RHA)

ThermalPad (GND)

2

3

4

5

6

7

1

24

23

22

21

27

26

25

VCC

OUTP8

OUTN9

OUTP9

OUTN8

OUTN0

OUTP0

VCC

OUTN10

OUTP10

8

9

10

OUTN1

OUTP1

OUTN2

OUTP2

OUTN3

OUTP3

VCC

30

29

28

VCC

OUTN11

OUTP11

11

12

13

14

15

16

17

37

36

35

34

33

32

31

18

19

20

40

39

38

CDCLVD2106

SCAS902B – SEPTEMBER 2010 – REVISED JANUARY 2011

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Figure 2. CDCLVD2106 Block Diagram

2

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Product Folder Link(s): CDCLVD2106