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INA270, INA271

SBOS381E – FEBRUARY 2007 – REVISED JANUARY 2018

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(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input voltage

–16

12

80

V

VS

Operating supply voltage

2.7

5

18

V

TA

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

INA27x

UNIT

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

78.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

71.6

°C/W

RθJB

Junction-to-board thermal resistance

68.2

°C/W

ψJT

Junction-to-top characterization parameter

22.0

°C/W

ψJB

Junction-to-board characterization parameter

67.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W