ISO6761FDWR.B datasheet(37/50 Pages) TI2

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12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Digital Isolator Design Guide

• Texas Instruments, Isolation Glossary

• Texas Instruments, How to use isolation to improve ESD, EFT, and Surge immunity in industrial systems

application report

• Texas Instruments, ADS79xx 12/10/8-Bit, 1 MSPS, 16/12/8/4-Channel, Single-Ended, MicroPower, Serial

Interface ADCs data sheet

• Texas Instruments, DAC161P997 Single-Wire 16-bit DAC for 4- to 20-mA Loops data sheet

• Texas Instruments, MSP430G2132Mixed Signal Microcontroller data sheet

• Texas Instruments, SN6501 Transformer Driver for Isolated Power Supplies data sheet

• Texas Instruments, TPS76333Low-Power 150-mA Low-Dropout Linear Regulators data sheet

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

12.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

12.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

12.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

ISO6760, ISO6761, ISO6762, ISO6763

SLLSFK0E – AUGUST 2021 – REVISED FEBRUARY 2023

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Product Folder Links: ISO6760 ISO6761 ISO6762 ISO6763

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