5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Dual supply, VS = (V+) – (V–)

±22

V

Signal input pins

Continuous

±200

V

Peak (0.1s)

±500

V

Output short-circuit(2)

Continuous

TA

Operating temperature

–40

85

°C

Tstg

Storage temperature

–55

125

°C

Junction temperature

150

°C

Lead temperature (soldering, 10s)

300

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to VS / 2.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VS

Supply voltage

Single-supply

10

30

36

V

Dual-supply

±5

±15

±18

TA

Specified temperature

–40

85

°C

5.4 Thermal Information

THERMAL METRIC(1)

INA117

INA117

UNIT

D (SOIC)

P (PDIP)

8 PINS

8 PINS

θJA

Junction-to-ambient thermal resistance

150

80

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

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INA117

SBOS154B – SEPTEMBER 2000 – REVISED APRIL 2024

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