6.4 Thermal Information: INA126

THERMAL METRIC(1)

INA126

UNIT

PDIP

SOIC

VSSOP

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

52.2

116.4

167.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

41.6

62.4

60.9

°C/W

RθJB

Junction-to-board thermal resistance

29.4

57.7

88.9

°C/W

ψJT

Junction-to-top characterization parameter

18.9

10.0

7.3

°C/W

ψJB

Junction-to-board characterization parameter

29.2

57.1

87.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Thermal Information: INA2126

THERMAL METRIC(1)

INA2126

UNIT

PDIP

SOIC

SSOP

16 PINS

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

39.3

76.2

115.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

26.2

37.8

67.0

°C/W

RθJB

Junction-to-board thermal resistance

20.1

33.5

58.3

°C/W

ψJT

Junction-to-top characterization parameter

10.7

7.5

19.9

°C/W

ψJB

Junction-to-board characterization parameter

19.9

33.3

57.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA126, INA2126

SBOS062C – SEPTEMBER 2000 – REVISED JANUARY 2022

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