LM5166DRCT datasheet(4/57 Pages) TI2

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LM5166

SNVSA67B – DECEMBER 2016 – REVISED JUNE 2017

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Fixed output setting.

(4)

Adjustable output setting.

6 Specifications

6.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted).

(1) (2)

MIN

MAX

UNIT

VIN, EN to GND

–0.3

SW to GND

–0.7

VVIN + 0.3

20-ns transient

–3

PGOOD, VOUT(3) to GND

–0.3

HYS to GND

–0.3

ILIM, SS, RT, FB(4) to GND

–0.3

3.6

Maximum junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

Operating Ratings are conditions under which the device is intended to be functional. For specifications and test conditions, see

Electrical Characteristics.

6.3 Recommended Operating Conditions

Over the recommended operating junction temperature range of –40°C to 150°C (unless otherwise noted).

(1)

MIN

NOM

MAX

UNIT

Input voltages

VIN

–0.3

PGOOD

–0.3

HYS

–0.3

5.5

Output current

IOUT

500

Temperature

Operating junction temperature

–40

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM5166

UNIT

DRC (VSON)

10 PINS

RθJA

Junction-to-ambient thermal resistance

49.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57.2

°C/W

RθJB

Junction-to-board thermal resistance

26.6

°C/W

ψJT

Junction-to-top characterization parameter

0.8

°C/W

ψJB

Junction-to-board characterization parameter

23.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

4.8

°C/W

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