• Changed THD from 0.01% to 0.02% in Electrical Characteristics: VS = 3V ......................................................9

Changes from Revision G (April 2020) to Revision H (November 2023)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Deleted specifications are typical, high voltage gain, and power good output from Features ...........................1

• Deleted M version device from data sheet; see the LMC6482QML for more information..................................1

• Updated front page figures in Description ......................................................................................................... 1

• Updated Pin Configuration and Functions .........................................................................................................2

• Added ± to input offset voltage, input offset voltage drift, input bias current, and input offset current in

Electrical Characteristics ................................................................................................................................... 6

• Updated parameter names throughout Electrical Characteristics for consistency............................................. 6

• Deleted notes 1, 2, and 3 from Electrical Characteristics ..................................................................................6

• Changed supply current specification from total to per amplifier in Electrical Characteristics ...........................6

• Deleted Figure 11 to 13, Figure 19 to 23, Figure 32 to 33, and Figure 47 to 52.............................................. 10

• Updated functional block diagram.................................................................................................................... 17

• Updated description of the input stage in Amplifier Topology ..........................................................................17

• Added Input Offset Voltage vs Common-Mode Voltage plot in Amplifier Topology ......................................... 17

• Updated the description in Rail-to-Rail Output ................................................................................................ 18

• Added an improved instrumentation amplifier circuit to Instrumentation Circuits ............................................ 20

• Added Figure 7-7, Open-Loop Output Impedance and related content to Capacitive Load Compensation ... 22

• Added OPA928 femtoampere-input bias-current op-amp recommendation to Typical Single-Supply

Applications ..................................................................................................................................................... 25

• Deleted references to the library disk in Spice Macromodel ........................................................................... 30

Changes from Revision F (April 2020) to Revision G (April 2020)

Page

• Deleted old note 4 from Electrical Characteristics for V+ = 5 V table.................................................................6

Changes from Revision E (April 2015) to Revision F (April 2020)

Page

• Changed junction temperature max value from –85°C to 85°C (typo) in Recommended Operating Conditions

table.................................................................................................................................................................... 4

Changes from Revision D (March 2013) to Revision E (April 2015)

Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ............................................................................................................................................................... 1

Changes from Revision C (March 2013) to Revision D (March 2013)

Page

• Changed layout of National Semiconductor Data Sheet to TI format...............................................................25

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

LMC6482

LMC6484

SNOS674J – OCTOBER 1997 – REVISED SEPTEMBER 2024

www.ti.com

32

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