5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)(1)

MIN

MAX

UNIT

VI

Input voltage(2)

–0.5

7

V

VI/O

Input/output voltage(2)

–0.5

7

V

Continuous channel current

128

mA

IIK

Input clamp current

VI < 0

–50

mA

TJ

Junction Temperature

150

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

The input and input or output negative-voltage ratings may be exceeded if the input and input or output clamp-current ratings are

observed.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250V CDM is possible with the necessary precautions.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VI/O

Input/output voltage

0

5.5

V

Vref_A/B/EN

Reference voltage

0

5.5

V

IPASS

Pass transistor current

64

mA

TA

Operating free-air temperature

–40

125

°C

5.4 Thermal Information

THERMAL METRIC(1)

LSF0102

UNIT

DCU (US8)

DCT (SM8)

DQE

(X2SON8)

YZT (DSBGA) DDF (SOT-23)

DTM

(X2SON8)

8 PINS

8 PINS

8 PINS

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

279.7

220.0

246.5

125.5

243.3

283.6

°C/W

RθJC(top) Junction-to-case (top) thermal

resistance

129.9

128.1

149.1

1.0

168.7

184.2

°C/W

RθJB

Junction-to-board thermal resistance

191.3

135.6

100.0

62.7

157.6

187.0

°C/W

ψJT

Junction-to-top characterization

parameter

66.3

56.0

17.1

3.4

45.9

25.0

°C/W

ψJB

Junction-to-board characterization

parameter

190.1

134.0

99.8

62.7

157.2

186.3

°C/W

RθJC(bot) Junction-to-case (bottom) thermal

resistance

n/a

n/a

n/a

n/a

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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LSF0102

SDLS972B – APRIL 2023 – REVISED APRIL 2024

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