6.4 Thermal Information

THERMAL METRIC(1)

MAX3232

UNIT

SOIC (D)

SSOP (DB)

SOIC (DW)

TSSOP (PW)

16 PINS

RθJA

Junction-to-ambient thermal resistance

85.9

103.1

66.6

108.2

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

43.1

49.2

32.4

39.0

°C/W

RθJB

Junction-to-board thermal resistance

44.5

54.8

31.9

54.4

°C/W

ψJT

Junction-to-top characterization parameter

10.1

12

8.4

3.3

°C/W

ψJB

Junction-to-board characterization parameter

44.1

54.1

31.5

53.8

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics — Device

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Typical

Operating Circuit and Capacitor Values)

PARAMETER

TEST CONDITIONS

MIN TYP(1)

MAX

UNIT

ICC

Supply current

No load,

VCC = 3.3 V to 5 V

0.3

1

mA

(1)

All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

(2)

Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.

6.6 Electrical Characteristics — Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) (see Typical

Operating Circuit and Capacitor Values)

PARAMETER

TEST CONDITIONS

MIN

TYP(1)

MAX

UNIT

VOH

High-level output voltage

DOUT at RL = 3 kΩ to GND, DIN = GND

5

5.4

V

VOL

Low-level output voltage

DOUT at RL = 3 kΩ to GND, DIN = VCC

–5

–5.4

V

IIH

High-level input current

VI = VCC

±0.01

±1

μA

IIL

Low-level input current

VI at GND

±0.01

±1

μA

IOS (2)

Short-circuit output current

VCC = 3.6 V

VO = 0 V

±35

±60

mA

VCC = 5.5 V

VO = 0 V

rO

Output resistance

VCC, V+, and V– = 0 V

VO = ±2 V

300

10M

Ω

(1)

All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

(2)

Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one

output should be shorted at a time.

(3)

Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5

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MAX3232

SLLS410O – JANUARY 2000 – REVISED JUNE 2021

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