MSP430F2011IPWR datasheet(96/102 Pages) TI2

96 / 102 page

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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

16X (0.31)

16X (0.6)

(

0.2) TYP

VIA

12X (0.65)

(3.8)

(1.1)

(

2.7)

(R0.05) TYP

(1.1)

VQFN - 1 mm max height

RSA0016B

PLASTIC QUAD FLATPACK - NO LEAD

4219093/A 08/2021

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:18X

NOTES: (continued)

5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

MSP430F2011IPWR Datasheet(PDF) 96 Page - Texas Instruments

MSP430F2011IPWR Datasheet(HTML) 96 Page - Texas Instruments

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