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STPS3L25S Datasheet(PDF) 4 Page - STMicroelectronics |
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STPS3L25S Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 5 page ![]() STPS3L25S 4/5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 1 10 50 IFM(A) Typical values Tj=150°C Tj=25°C Tj=100°C Tj=125°C VFM(V) Fig. 9-1: Forward voltage drop versus forward current (maximum values, high level). 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 30 40 50 60 70 80 90 100 S(Cu) (cm²) Rth(j-a) (°C/W) Fig. 10: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 0.1 0.2 0.3 0.4 0.5 0.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 IFM(A) Typical values Tj=150°C Tj=25°C Tj=100°C Tj=125°C VFM(V) Fig. 9-2: Forward voltage drop versus forward current (maximum values, low level). |
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