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OPA172IDBVT Datasheet(PDF) 39 Page - Texas Instruments |
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OPA172IDBVT Datasheet(HTML) 39 Page - Texas Instruments |
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39 / 60 page  www.ti.com PACKAGE OUTLINE C 8X 0.3 0.2 2 0.1 2X 1.5 1.2 0.1 6X 0.5 0.8 0.7 8X 0.6 0.4 0.05 0.00 A 3.1 2.9 B 3.1 2.9 (0.2) TYP WSON - 0.8 mm max height DRG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218885/A 03/2020 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 4 5 8 PIN 1 ID 0.1 C A B 0.08 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.000 |
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