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OPA4172IPW.B Datasheet(PDF) 29 Page - Texas Instruments

Part # OPA4172IPW.B
Description  OPAx172 36-V, Single-Supply, 10-MHz, Rail-to-Rail Output Operational Amplifiers
PDF  60 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

OPA4172IPW.B Datasheet(HTML) 29 Page - Texas Instruments

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NC
±IN
+IN
V±
V+
OUTPUT
NC
NC
VS+
VS±
GND
Ground (GND) plane on another layer
VOUT
VIN
GND
Run the input traces
as far away from
the supply lines
as possible
RF
RG
Place components close
to device and to each
other to reduce parasitic
errors
Use low-ESR,
ceramic bypass
capacitor
GND
Use a low-ESR,
ceramic bypass
capacitor
29
OPA172, OPA2172, OPA4172
www.ti.com
SBOS618I – DECEMBER 2013 – REVISED MAY 2018
Product Folder Links: OPA172 OPA2172 OPA4172
Submit Documentation Feedback
Copyright © 2013–2018, Texas Instruments Incorporated
11 Layout
11.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
•
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and op amp
itself. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power
sources local to the analog circuitry.
–
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
•
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective
methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground
planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically
separate digital and analog grounds paying attention to the flow of the ground current. For more detailed
information refer to SLOA089, Circuit Board Layout Techniques.
•
In order to reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular as opposed
to in parallel with the noisy trace is preferable.
•
Place the external components as close to the device as possible. As shown in Figure 52, keeping RF
and RG close to the inverting input minimizes parasitic capacitance.
•
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
•
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly
reduce leakage currents from nearby traces that are at different potentials.
11.2 Layout Example
Figure 52. Operational Amplifier Board Layout for Noninverting Configuration



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