OPA2375IPWR datasheet(8/67 Pages) TI2

8 / 67 page

7.4 Thermal Information for Single Channel (continued)

THERMAL METRIC (1)

OPA375

UNIT

DCK

(SC70)

5 PINS

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

℃/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report SPRA953C.

7.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

OPA2375, OPA2375S

UNIT

(SOIC)

DDF

(SOT-23-8)

DSG

(WSON)

(TSSOP)

DGK

(VSSOP)

RUG

(X2QFN)

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal

resistance

131.1

153.8

78.2

185.6

177.0

140.3

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

73.2

80.2

97.5

74.5

68.6

52.6

°C/W

RθJB

Junction-to-board thermal

resistance

74.5

73.1

44.6

116.3

98.7

69.7

°C/W

ψJT

Junction-to-top

characterization parameter

24.4

6.6

4.7

12.6

12.4

1.0

°C/W

ψJB

Junction-to-board

characterization parameter

73.3

72.7

44.6

114.6

97.1

67.5

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

n/a

19.8

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953C.

OPA375, OPA2375

SBOS886E – NOVEMBER 2017 – REVISED AUGUST 2021

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