OPA388IDBVT datasheet(7/50 Pages) TI2

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6.5 Thermal Information: OPA2388

THERMAL METRIC(1)

OPA2388

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

120.0

165

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

52.3

°C/W

RθJB

Junction-to-board thermal resistance

65.6

°C/W

ΨJT

Junction-to-top characterization parameter

9.6

4.9

°C/W

ΨJB

Junction-to-board characterization parameter

64.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.6 Thermal Information: OPA4388

THERMAL METRIC(1)

OPA4388

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

86.4

109.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

46.3

27.4

°C/W

RθJB

Junction-to-board thermal resistance

41.0

56.1

°C/W

ΨJT

Junction-to-top characterization parameter

11.3

1.5

°C/W

ΨJB

Junction-to-board characterization parameter

40.7

54.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.7 Electrical Characteristics: VS = ±1.25 V to ±2.75 V (VS = 2.5 to 5.5 V)

at TA = 25°C, VCM = VOUT = VS / 2, and RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

OFFSET VOLTAGE

VOS

Input offset voltage

OPA388, OPA2388

±0.25

±5

µV

VS = 5.5 V

OPA4388

±2.25

±8

TA = –40°C to +125°C

OPA388, OPA2388

±7.5

TA = –40°C to +125°C, VS = 5.5 V OPA4388

±10.5

dVOS/dT Input offset voltage drift

TA = –40°C to +125°C

OPA388, OPA2388

±0.005

±0.05

µV/°C

TA = –40°C to +125°C, VS = 5.5 V OPA4388

±0.005

±0.05

PSRR

Power-supply rejection

ratio

TA = –40°C to +125°C

OPA388, OPA2388

±0.1

±1

µV/V

OPA4388

±1.25

±3.5

www.ti.com

OPA388, OPA2388, OPA4388

SBOS777D – NOVEMBER 2016 – REVISED JULY 2020

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