4-2. Flow Soldering

1. Do not apply flow soldering to chips not listed in Table 2.

Table 2

(Except for Temperature Characteristics:5G)

2. When sudden heat is applied to the components, the mechanical strength of the components will decrease

because a sudden temperature change causes deformation inside the components.

In order to prevent mechanical damage to the components, preheating is required for both of the components and the PCB.

Preheating conditions are shown in table 2.

It is required to keep the temperature differential between the solder and the components surface (ΔT) as low as possible.

3. Excessively long soldering time or high soldering temperature can result in leaching of the terminations,

causing poor adhesion or a reduction in capacitance value due to loss of contact between the inner electrodes and terminations.

4. When components are immersed in solvent after mounting, be sure to maintain the temperature differential (ΔT)

between the component and solvent within the range shown in the table 2.

Recommended Conditions

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Lead Free Solder: Sn-3.0Ag-0.5Cu

5. Optimum Solder Amount for Flow Soldering

5-1. The top of the solder fillet should be lower than the thickness of the components.

If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition.

Soldering Peak

Temperature

250 to 260℃

Atmosphere

Air or N2

[ Allowable Flow Soldering Temperature and Time ]

Item

Lead Free Solder

Preheating Peak

Temperature

100 to 120℃

[ Standard Conditions for Flow Soldering ]

Series

Chip Dimension(L/W) Code

Temperature Differential

GQM

18/21

ΔT≦150℃

GQM1555C2DR10WB01-01A

18