4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

7

V

VI

Input voltage(2)

–0.5

VCC + 0.5

V

VO

Voltage range applied to any output in the high-impedance or power-off state(2)

–0.5

VCC + 0.5

V

IIK

Input clamp current

(VI < 0 or VI > VCC)

±20

mA

IOK

Output clamp current

(VO < 0 or VO > VCC)

±20

mA

IO

Continuous output current

(VO = 0 to VCC)

±50

mA

Continuous current through VCC or GND

±200

mA

Tstg

Storage temperature range

–65

150

°C

4.2 Recommended Operating Conditions

over recommended operating free-air temperature range (unless otherwise noted)

SN54ACT74

SN74ACT74

UNIT

MIN

MAX

MIN

MAX

VCC

Supply voltage

4.5

5.5

4.5

5.5

V

VIH

High-level input voltage

2

2

V

VIL

Low-level input voltage

0.8

0.8

V

VI

Input voltage

0

VCC

0

VCC

V

VO

Output voltage

0

VCC

0

VCC

V

IOH

High-level output current

–24

–24

mA

IOL

Low-level output current

24

24

mA

∆t/∆v

Input transition rise and fall rate

8

8

ns/V

TA

Operating free-air temperature

–55

125

–40

85

°C

4.3 Thermal Information

THERMAL METRIC(1)

SN74ACT74

BQA

(WQFN)

D (SOIC)

DB (SSOP)

N

(PDIP)

NS

(SOP)

PW

(TSSOP)

UNIT

14 PINS

RθJA

Junction-to-ambient

thermal resistance

91.3

119.9

96

80

76

145.7

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

99.4

—

—

—

—

—

°C/W

RθJB

Junction-to-board

thermal resistance

60.1

—

—

—

—

—

°C/W

ψJT

Junction-to-top

characterization parameter

14.5

—

—

—

—

—

°C/W

ψJB

Junction-to-board characterization

parameter

60.8

—

—

—

—

—

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

37.0

—

—

—

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

SN54ACT74, SN74ACT74

SCAS520J – AUGUST 1995 – REVISED APRIL 2025

www.ti.com

4

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