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SN74LVC04APWRG3 Datasheet(PDF) 6 Page - Texas Instruments

Part # SN74LVC04APWRG3
Description  SNx4LVC04A Hex Inverters
PDF  42 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

SN74LVC04APWRG3 Datasheet(HTML) 6 Page - Texas Instruments

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SN54LVC04A, SN74LVC04A
SCAS281T – JANUARY 1993 – REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: SN54LVC04A SN74LVC04A
Submit Documentation Feedback
Copyright © 1993–2016, Texas Instruments Incorporated
Recommended Operating Conditions (continued)
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
IOL
Low-level output current
VCC = 1.65 V, SN74LVC04A only
4
mA
VCC = 2.3 V, SN74LVC04A only
8
VCC = 2.7 V
12
VCC = 3 V
24
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information – SN54LVC04A
THERMAL METRIC(1)
SN54LVC04A
UNIT
J (CDIP)
W (CFP)
FK (LCCC)
14 PINS
14 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
92
158.2
85
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
55.1
88.7
62.5
°C/W
RθJB
Junction-to-board thermal resistance
80.5
156.5
61.2
°C/W
ψJT
Junction-to-top characterization parameter
40.2
58.5
55.8
°C/W
ψJB
Junction-to-board characterization parameter
74.2
135.5
61.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
25.3
15.3
10.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information – SN74LVC04A
THERMAL METRIC(1)
SN74LVC04A
UNIT
D
(SOIC)
DB
(SSOP)
DGV
(TVSOP)
NS
(SOP)
PW
(TSSOP)
RGY
(VQFN)
14 PINS
14 PINS
14 PINS
14 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal
resistance
105.7
113.1
142.7
95.4
129.5
63.2
°C/W
RθJC(top)
Junction-to-case (top) thermal
resistance
50.8
65.1
61.9
53.2
57.9
61
°C/W
RθJB
Junction-to-board thermal resistance
46.1
60.5
72.1
54.2
71.3
39.1
°C/W
ψJT
Junction-to-top characterization
parameter
8.2
29.1
10.1
21.9
9.9
5.2
°C/W
ψJB
Junction-to-board characterization
parameter
45.6
60
71.4
53.8
70.7
39.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal
resistance
—
—
—
—
—
20.3
°C/W



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