SN74LVC1G97DBVT.B datasheet(11/40 Pages) TI2

11 / 40 page

MCU

(MSP43x)

Temperature

Sensor

VCC = 5 V

VCC

LVC1G97

GND

MCU

(MSP43x)

Temperature

Sensor

VCC = 5 V

SN74LVC1G97

www.ti.com

SCES416N – DECEMBER 2002 – REVISED JANUARY 2017

Product Folder Links: SN74LVC1G97

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Validate and test

the design implementation to confirm system functionality.

9.1 Application Information

The SN74LVC1G97 device offers flexible configuration for many design applications. This example describes

basic power sequencing using the AND gate configuration. Power sequencing is often used in applications that

require a processor or other delicate device with specific voltage timing requirements in order to protect the

device from malfunctioning.

Figure 10. Simplified Application

9.2 Typical Application

Figure 11. Typical Application

9.2.1 Design Requirements

•

Recommended input conditions:

–

For rise time and fall time specifications, see Δt/Δv in the Recommended Operating Conditions table.

–

For specified high and low levels, see VIH and VIL in the Recommended Operating Conditions table.

–

Inputs and outputs are overvoltage tolerant and can therefore go as high as 5.5 V at any valid VCC.

•

Recommended output conditions:

–

Load currents must not exceed ±50 mA.

•

Frequency selection criterion:

–

Figure 12 illustrates the effects of frequency on output current.

–

Added trace resistance and capacitance can reduce maximum frequency capability. Follow the layout

practices listed in the Layout section.

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