5.3 Recommended Operating Conditions

over recommended operating free-air temperature range (unless otherwise noted)(1)

TA = 25°C

–40 TO +85°C

–40 TO +125°C

UNIT

MIN

MAX

MIN

MAX

MIN

MAX

VCC Supply voltage

Operating

1.65

3.6

1.65

3.6

1.65

3.6

V

Data retention only

1.5

1.5

1.5

VIH

High-level

input voltage

VCC = 1.65V to 1.95V

0.65 × VCC

0.65 × VCC

0.65 × VCC

V

VCC = 2.3V to 2.7V

1.7

1.7

1.7

VCC = 2.7V to 3.6V

2

2

2

VIL

Low-level

input voltage

VCC = 1.65V to 1.95V

0.35 × VCC

0.35 × VCC

0.35 × VCC

V

VCC = 2.3V to 2.7V

0.7

0.7

0.7

VCC = 2.7V to 3.6V

0.8

0.8

0.8

VI

Input voltage

0

5.5

0

5.5

0

5.5

V

VO

Output voltage

0

VCC

0

VCC

0

VCC

V

IOH

High-level

output current

VCC = 1.65V

–4

–4

–4

mA

VCC = 2.3V

–8

–8

–8

VCC = 2.7V

–12

–12

–12

VCC = 3V

–24

–24

–24

IOL

Low-level

output current

VCC = 1.65V

4

4

4

mA

VCC = 2.3V

8

8

8

VCC = 2.7V

12

12

12

VCC = 3V

24

24

24

TA

Ambient

temperature

BGA package

–40

85

°C

All other packages

–40

125

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating

CMOS Inputs , SCBA004.

5.4 Thermal Information

THERMAL METRIC(1)

SN74LVC244A

UNIT

DB(2)

(SSOP)

DGV(2)

(TVSOP)

DW (2)

(SOIC)

ZQN(2)

(BGA)

N(2)

(PDIP)

NS(2)

(SO)

PW(2)

(TSSOP

)

RGY(3)

(VQFN)

RWP(3)

(X1QFN)

RKS(3)

(VQFN

)

20 PINS

RθJA

Junction-to-ambient

thermal resistance

108.1

128.7

90.9

198.7

61.6

90.1

114.7

50.3

79.9

87.2

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

70.2

43.7

55.3

106.8

46.5

56.4

48.4

58.4

63.2

93.4

°C/W

RθJB

Junction-to-board

thermal resistance

63.3

70.2

58.8

143.1

42.5

57.7

65.6

28.3

46.4

59.8

°C/W

ψJT

Junction-to-top

characterization parameter

30.6

3.1

29.1

24.1

34.6

28.4

6.8

4.9

2.6

24.9

°C/W

ψJB

Junction-to-board

characterization parameter

62.9

69.5

58.3

119.6

42.4

57.2

65.1

28.4

46.3

59.6

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

—

—

—

n/a

—

—

—

22.7

27.3

44.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

(3)

The package thermal impedance is calculated in accordance with JESD 51-5.

SN74LVC244A

SCAS414AE – NOVEMBER 1992 – REVISED AUGUST 2025

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