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THS4505DR Datasheet(PDF) 28 Page - Texas Instruments

Part # THS4505DR
Description  WIDEBAND, LOW-DISTORTION, FULLY DIFFERENTIAL AMPLIFIERS
PDF  51 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

THS4505DR Datasheet(HTML) 28 Page - Texas Instruments

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PC BOARD LAYOUT TECHNIQUES FOR
THS4504
THS4505
SLOS363D – AUGUST 2002 – REVISED MAY 2008 ......................................................................................................................................................... www.ti.com
add a pole and/or a zero below 400 MHz that can
OPTIMAL PERFORMANCE
effect circuit operation. Keep resistor values as
low as possible, consistent with load driving
Achieving
optimum
performance
with
a
high
considerations.
frequency amplifier-like devices in the THS4500
• Connections to other wideband devices on the
family requires careful attention to board layout
board may be made with short direct traces or
parasitic and external component types.
through onboard transmission lines. For short
Recommendations that optimize performance include:
connections, consider the trace and the input to
the next device as a lumped capacitive load.
• Minimize parasitic capacitance to any ac ground
Relatively wide traces (50 mils to 100 mils) should
for all of the signal I/O pins. Parasitic capacitance
be used, preferably with ground and power planes
on the output and input pins can cause instability.
opened up around them. Estimate the total
To reduce unwanted capacitance, a window
capacitive load and determine if isolation resistors
around the signal I/O pins should be opened in all
on the outputs are necessary. Low parasitic
of the ground and power planes around those
capacitive loads (< 4 pF) may not need an RS
pins. Otherwise, ground and power planes should
since
the
THS4500
family
is
nominally
be unbroken elsewhere on the board.
compensated to operate with a 2-pF parasitic
• Minimize the distance (< 0.25”) from the
load. Higher parasitic capacitive loads without an
power-supply
pins
to
high-frequency
0.1-
µF
RS are allowed as the signal gain increases
decoupling capacitors. At the device pins, the
(increasing the unloaded phase margin). If a long
ground and power-plane layout should not be in
trace is required, and the 6-dB signal loss intrinsic
close proximity to the signal I/O pins. Avoid
to
a
doubly-terminated
transmission
line
is
narrow power and ground traces to minimize
acceptable, implement a matched impedance
inductance between the pins and the decoupling
transmission line using microstrip or stripline
capacitors. The power-supply connections should
techniques (consult an ECL design handbook for
always
be
decoupled
with
these
capacitors.
microstrip and stripline layout techniques).
Larger (6.8
µF or more) tantalum decoupling
• A 50-Ω environment is normally not necessary
capacitors, effective at lower frequency, should
onboard,
and
in
fact,
a
higher
impedance
also be used on the main supply pins. These may
environment improves distortion as shown in the
be placed somewhat farther from the device and
distortion versus load plots. With a characteristic
may be shared among several devices in the
board trace impedance defined based on board
same area of the PC board. The primary goal is to
material and trace dimensions, a matching series
minimize
the
impedance
seen
in
the
resistor into the trace from the output of the
differential-current return paths.
THS4500 family is used as well as a terminating
• Careful selection and placement of external
shunt resistor at the input of the destination
components
preserve
the
high
frequency
device.
performance of the THS4500 family. Resistors
• Remember also that the terminating impedance is
should
be
a
very
low
reactance
type.
the parallel combination of the shunt resistor and
Surface-mount resistors work best and allow a
the input impedance of the destination device: this
tighter
overall
layout.
Metal-film
and
carbon
total effective impedance should be set to match
composition, axially-leaded resistors can also
the trace impedance. If the 6-dB attenuation of a
provide good high frequency performance. Again,
doubly
terminated
transmission
line
is
keep their leads and PC board trace length as
unacceptable,
a
long
trace
can
be
short as possible. Never use wirewound type
series-terminated at the source end only. Treat
resistors in a high-frequency application. Since the
the trace as a capacitive load in this case. This
output pin and inverting input pins are the most
does not preserve signal integrity as well as a
sensitive to parasitic capacitance, always position
doubly-terminated line. If the input impedance of
the feedback and series output resistors, if any, as
the destination device is low, there is some signal
close as possible to the inverting input pins and
attenuation due to the voltage divider formed by
output pins. Other network components, such as
the series output into the terminating impedance.
input termination resistors, should be placed close
to the gain-setting resistors. Even with a low
• Socketing a high speed part like the THS4500
parasitic
capacitance
shunting
the
external
family is not recommended. The additional lead
resistors, excessively high resistor values can
length and pin-to-pin capacitance introduced by
create significant time constants that can degrade
the socket can create an extremely troublesome
performance.
Good
axial
metal-film
or
parasitic network which can make it almost
surface-mount
resistors
have
approximately
impossible to achieve a smooth, stable frequency
0.2 pF in shunt with the resistor. For resistor
response. Best results are obtained by soldering
values > 2.0 k
Ω, this parasitic capacitance can
the THS4500 family parts directly onto the board.
28
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Copyright © 2002–2008, Texas Instruments Incorporated
Product Folder Link(s): THS4504 THS4505



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