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STTH602CBY-TR Datasheet(PDF) 5 Page - STMicroelectronics |
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STTH602CBY-TR Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() STTH602C-Y Characteristics DocID023250 Rev 2 5/9 Figure 7: Reverse recovery time versus dIF/dt (typical values, per diode) Figure 8: Reverse recovery current versus dIF/dt (typical values, per diode) Figure 9: Dynamic parameters versus junction temperature Figure 10: Thermal resistance junction to ambient versus copper surface under tab for DPAK package (typical values) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 SCu(cm²) Rth(j-a) (°C/W) DPAK Epoxy printed board FR4, eCu= 35 µm 90 100 |
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