9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, TMP102 Low-Power Digital Temperature Sensor With SMBus and Two-Wire Serial

Interface in SOT563, data sheet

• Texas Instruments, TMP112x High-Accuracy, Low-Power, Digital Temperature Sensors With SMBus and

TwoWire Serial Interface in SOT563, data sheet

• Texas Instruments, TMP110 Ultra-Small, ±1.0°C Accurate, I2C Digital Temperature Sensor for Cost-Sensitive

Systems, data sheet

• Texas Instruments, TMP LM 75 Comparison Common FAQs, application note

•

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (August 2021) to Revision F (June 2024)

Page

• Changed all instances of legacy terminology to controller and target where I2C is mentioned......................... 1

• Updated the number format for tables, figures, and cross-references throughout the document...................... 1

• Changed the "Conversion time" for TMP1075N throughout the document........................................................ 1

• Changed the shutdown and average current for TMP1075N throughout the document.................................... 1

• Changed DRL package Thermal Information section.........................................................................................6

• Changed "Conversion time" for TMP1075N in Electrical Characteristics table.................................................. 7

• Changed Average current consumption for TMP1075N in Electrical Characteristics table................................7

• Changed Shutdown current for TMP1075N in Electrical Characteristics table.................................................. 7

• Added Two-Wire Timing Diagram.......................................................................................................................9

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TMP1075

SBOS854F – MARCH 2018 – REVISED JUNE 2024

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Product Folder Links: TMP1075