6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Power supply

V+

–0.3

6

V

Input voltage

THERM, ALERT/THERM2, SDA, and SCL only

–0.3

6

V

D+, A0, A1

–0.3

(V+) + 0.3

D– only

–0.3

0.3

Input current

10

mA

Operating temperature

–55

150

°C

Junction temperature, TJ max

150

°C

Storage temperature, Tstg

–60

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM), JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V+

Supply voltage

1.7

3.3

3.6

V

TA

Operating temperature

–55

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMP461-EP

UNIT

DGS (VSSOP)

10 PINS

RθJA

Junction-to-ambient thermal resistance

138.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

47.9

°C/W

RθJB

Junction-to-board thermal resistance

73.4

°C/W

ψJT

Junction-to-top characterization parameter

2.0

°C/W

ψJB

Junction-to-board characterization parameter

72

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

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TMP461-EP

SNIS241 – SEPTEMBER 2025

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