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TMUX1219

SCDS409A – MAY 2019 – REVISED JUNE 2020

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(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2).

MIN

MAX

UNIT

VDD

Supply voltage

–0.5

6

V

VSEL

Logic control input pin voltage (SEL)

–0.5

6

V

ISEL

Logic control input pin current (SEL)

–30

30

mA

VS or VD

Source or drain voltage (Sx, D)

–0.5

VDD+0.5

V

IS or ID (CONT)

Source or drain continuous current (Sx, D)

–30

30

mA

Tstg

Storage temperature

–65

150

°C

TJ

Junction temperature

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101

or ANSI/ESDA/JEDEC JS-002, all pins(2)

±750

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted).

MIN

NOM

MAX

UNIT

VDD

Supply voltage

1.08

5.5

V

VS or VD

Signal path input/output voltage (source or drain pin) (Sx, D)

0

VDD

V

VSEL

Logic control input pin voltage (SEL)

0

5.5

V

TA

Ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TMUX1219

UNIT

DCK (SC70)

DBV (SOT-23)

6 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

243.1

212.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

206.0

156.7

°C/W

RθJB

Junction-to-board thermal resistance

128.3

96.5

°C/W

ΨJT

Junction-to-top characterization parameter

107.8

80.7

°C/W

ΨJB

Junction-to-board characterization parameter

128.0

96.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W