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STM32H533CE Datasheet(PDF) 223 Page - STMicroelectronics |
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STM32H533CE Datasheet(HTML) 223 Page - STMicroelectronics |
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223 / 231 page ![]() DS14539 Rev 1 223/231 STM32H533xx Package information 227 6.9 UFBGA144 package information (A0Y2) This UFBGA is a 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package. Note: See list of notes in the notes section. Figure 75. UFBGA144 - Outline(13) e D A Øb (144 balls) M E SIDE VIEW BOTTOM VIEW 1 A A B ddd C D1 E1 eee C A B fff Ø Ø M M C A1 ball pad corner A1 ball pad corner SD e B C D E G H J K L 234 5 6 7 89 10 12 11 A2 C (4x) 8 Seating plane DETAIL A Substrate Solder balls Mold resin A1 DETAIL A aaa C ccc C (DATUM A) (DATUM B) A02Y_UFBGA144_ME_V3 7 TOP VIEW SE |
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