5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

VCC

Supply voltage(3)

–0.3

5.5

V

VI/O

Input/Output DC voltage(3)

–0.3

5.5

V

IK

Input/Output port diode current (VI/O < 0)

–50

mA

VI

Digital input voltage (SEL0, SEL1)

–0.3

5.5

IIK

Digital logic input clamp current (VI < 0)(3)

–50

mA

II/O

Continuous switch DC output current (USB and MHL)

60

mA

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±1000 V may actually have higher performance.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

2.5

4.3

V

VI/O (USB),

VI/O (MHL)

Analog voltage

0

3.6

V

VI

Digital input voltage (SEL0, SEL1)

0

VCC

V

TRAMP (VCC)

Power supply ramp time requirement (VCC)

100

1000

µs/V

II/O, PEAK

Peak switch DC output current (1-ms duration pulse at <10% duty cycle)

150

mA

TA

Operating free-air temperature

–40

85

°C

5.4 Thermal Information

THERMAL METRIC(1)

TS3USB3031

UNIT

RMG (VQFN)

12 PINS

RθJA

Junction-to-ambient thermal resistance

160.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

95.5

°C/W

RθJB

Junction-to-board thermal resistance

91.2

°C/W

ψJT

Junction-to-top characterization parameter

7.4

°C/W

ψJB

Junction-to-board characterization parameter

91.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

TS3USB3031

SCDS348D – SEPTEMBER 2013 – REVISED AUGUST 2024

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