5.4 Thermal Information

THERMAL METRIC(1)

LM2902-Q1, LM2902KV-Q1,

LM2902KAV-Q1

LM2902B-Q1, LM2902BA-Q1

UNIT

D (SOIC)

PW (TSSOP)

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

101

86

99.3

133.3

°C/W

RθJC

Junction-to-case (top) thermal resistance

—

—

60.4

63.4

°C/W

RθJB

Junction-to-board thermal resistance

—

—

57.5

76.5

°C/W

ψJT

Junction-to-top characterization parameter

—

—

19.8

15.6

°C/W

ψJB

Junction-to-board characterization

parameter

—

—

57.0

75.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

note.

www.ti.com

LM2902-Q1, LM2902B-Q1, LM2902BA-Q1

SGLS178I – AUGUST 2003 – REVISED NOVEMBER 2024

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Product Folder Links: LM2902-Q1 LM2902B-Q1 LM2902BA-Q1