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FMA3014 Datasheet(PDF) 2 Page - Filtronic Compound Semiconductors

Part # FMA3014
Description  12.7-16GHZ MMIC LIMITING AMPLIFIER
PDF  6 Pages
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Manufacturer  FILTRONIC [Filtronic Compound Semiconductors]
Direct Link  http://www.filtronic.co.uk/
Logo FILTRONIC - Filtronic Compound Semiconductors

FMA3014 Datasheet(HTML) 2 Page - Filtronic Compound Semiconductors

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Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
5 306177
Email: sales@filcs.com
FMA3014
Datasheet v3.0
ABSOLUTE MAXIMUM RATINGS:
Tel: +44 (0) 1325 301111
Fax: +44 (0) 132
Website: www.filtronic.com
2
Note:
Exceeding any one of these absolute maximum
ratings may cause permanent damage to the device.
PAD LAYOUT:
Note: Co-ordinates are referenced from the bottom
left hand corner of the die to the centre of bond pad
opening.
Pads
without
identifiers
are
ground
connections used in wafer testing.
PARAMETER
SYMBOL
ABSOLUTE
MAXIMUM
Max Input Power
Pin
+20dBm
Gate Voltage
VG1
Not Required
Drain Voltage
VDD
+6V
Operating Temp
Toper
-40°C to +85°C
Storage Temp
Tstor
-55°C to +150°C
PAD
REF
PAD
NAME
DESCRIPTION
PIN
COORDINATES
(µm)
A
I
RF in
(97,961)
B
A
B
C
L
K
JI
H
G
F
E
D
B
BB
1st and 2nd stage drain
(1206,1248)
C
D
3rd and 4th stage drain
(2166,1248)
D
O
RF out
(2904,550)
E
E
4th stage bias adjust
(2721,102)
F
F
Ground for pad E
(2467,102)
G
G
3rd stage bias adjust
(1957,102)
H
H
Ground for pad G
(1703,102)
I
J
2nd stage bias adjust
(1225,102)
J
K
Ground for pad I
(1061,102)
K
L
1st stage bias adjust
(636,102)
L
M
Ground for pad K
(472,102)
DIE SIZE (
μm)
DIE THICKNESS (
μm)
MIN. BOND PAD PITCH
(
μm)
MIN. BOND PAD OPENING
(
μm x μm )
3000 x 1348
100
164um
100 x 100



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