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FDMS2572 Datasheet(PDF) 3 Page - ON Semiconductor

Part # FDMS2572
Description  N-Channel UltraFET Trench® MOSFET 150V, 27A, 47mΩ
PDF  9 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

FDMS2572 Datasheet(HTML) 3 Page - ON Semiconductor

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FDMS2572 Rev.C4
www.fairchildsemi.com
2
Electrical Characteristics T
J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250μA, VGS = 0V
150
V
ΔBVDSS
ΔTJ
Breakdown Voltage Temperature
Coefficient
ID = 250μA, referenced to 25°C
180
mV/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 120V, VGS = 0V
1
μA
IGSS
Gate to Source Leakage Current
VGS = ±20V, VDS = 0V
±100
nA
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250μA
2
3
4
V
ΔVGS(th)
ΔTJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = 250μA, referenced to 25°C
-9.8
mV/°C
rDS(on)
Drain to Source On Resistance
VGS = 10V, ID = 4.5A
36
47
m
Ω
VGS = 6V, ID = 4.5A
39
53
VGS = 10V, ID = 4.5A, TJ = 125°C
69
103
gFS
Forward Transconductance
VDS = 10V, ID = 4.5A
14
S
(Note 2)
Dynamic Characteristics
Ciss
Input Capacitance
VDS = 75V, VGS = 0V,
f = 1MHz
1960
2610
pF
Coss
Output Capacitance
130
175
pF
Crss
Reverse Transfer Capacitance
30
45
pF
Rg
Gate Resistance
f = 1MHz
0.1
1.3
2.6
Ω
Switching Characteristics
td(on)
Turn-On Delay Time
VDD = 75V, ID = 1.0A
VGS = 10V, RGEN = 6Ω
11
20
ns
tr
Rise Time
8
16
ns
td(off)
Turn-Off Delay Time
38
61
ns
tf
Fall Time
31
50
ns
Qg(TOT)
Total Gate Charge at 10V
VGS = 0V to 10V VDD = 75V
ID = 4.5A
31
43
nC
Qgs
Gate to Source Gate Charge
9
nC
Qgd
Gate to Drain “Miller” Charge
7
nC
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Forward Voltage
VGS = 0V, IS = 2.2A
(Note 2)
0.7
1.0
V
trr
Reverse Recovery Time
IF = 4.5A, di/dt = 100A/μs
67
101
ns
Qrr
Reverse Recovery Charge
130
195
nC
Notes:
1: RθJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by
the user's board design.
2: Pulse Test: Pulse Width < 300
μs, Duty cycle < 2.0%.
3: EAS of 150 mJ is based on starting TJ = 25 °C, L = 3 mH, IAS = 10 A, VDD = 150 V, VGS = 10 V.
a.50°C/W when mounted on
a 1 in2 pad of 2 oz copper
b. 125°C/W when mounted on a
minimum pad of 2 oz copper



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