LM185QML datasheet(4/15 Pages) NSC

4 / 15 page

Absolute Maximum Ratings (Note 1)

Reverse Current

30mA

Forward Current

10mA

Operating Temperature Range

−55˚C

≤ T

≤ 125˚C

Storage Temperature

−55˚C

≤ T

≤ 150˚C

Maximum Junction Temperature T

Jmax

150˚C

Lead Temperature (soldering, 10 seconds)

300˚C

Thermal Resistance

LCC Package (Still Air)

100˚C/W

LCC Package (500LF/Min Air flow)

73˚C/W

Metal Can Package (Still Air)

300˚C/W

Metal Can Package (500LF/Min Air flow)

139˚C/W

Ceramic SOIC Package (Still Air)

194˚C/W

Ceramic SOIC Package (500LF/Min Air flow)

128˚C/W

LCC Package

25˚C/W

Metal Can Package

57˚C/W

Ceramic SOIC Package

23˚C/W

Package Weight (Typical)

LCC Package

TBD

Metal Can Package

TBD

Ceramic SOIC Package

210mg

ESD Tolerance (Note 2)

500V

Quality Conformance Inspection

Mil-Std-883, Method 5005 - Group A

Subgroup

Description

Temp ˚C

Static tests at

125

Static tests at

-55

Dynamic tests at

125

Dynamic tests at

-55

Functional tests at

125

Functional tests at

-55

Switching tests at

125

Switching tests at

-55

Settling time at

125

Settling time at

-55

LM185QML Datasheet(PDF) 4 Page - National Semiconductor (TI)

LM185QML Datasheet(HTML) 4 Page - National Semiconductor (TI)

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