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L6590N Datasheet(PDF) 14 Page - STMicroelectronics |
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L6590N Datasheet(HTML) 14 Page - STMicroelectronics |
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14 / 23 page ![]() L6590 14/23 APPLICATION INFORMATION In the following sections the functional blocks as well as the most important internal functions of the device will be described. Start-up Circuit When power is first applied to the circuit and the voltage on the bulk capacitor is sufficiently high, an internal high-voltage current generator is sufficiently biased to start operating and drawing about 4.5 mA through the primary winding of the transformer and the drain pin. Most of this current charges the bypass capacitor connect- ed between pin Vcc (3) and ground and makes its voltage rise linearly. As the Vcc voltage reaches the start-up threshold (14.5V typ.) the chip, after resetting all its internal logic, starts operating, the internal power MOSFET is enabled to switch and the internal high-voltage generator is discon- nected. The IC is powered by the energy stored in the Vcc capacitor until the self-supply circuit (typically an auxiliary winding of the transformer) develops a voltage high enough to sustain the operation. As the IC is running, the supply voltage, typically generated by a self-supply winding, can range between 16 V (Overvoltage protection limit, see the relevant section) and 7 V, threshold of the Undervoltage Lockout. Below this value the device is switched off (and the internal start-up generator is activated). The two thresholds are in tracking. The voltage on the Vcc pin is limited at safe values by a clamp circuit. Its 17V threshold tracks the Overvoltage protection threshold. Figure 32. Start-up circuit internal schematic Power MOSFET and Gate Driver The power switch is implemented with a lateral N-channel MOSFET having a V(BR)DSS of 700V min. and a typ- ical RDS(on) of 13Ω. It has a SenseFET structure to allow a virtually lossless current sensing (used only for pro- tection). During operation in Discontinuous Conduction Mode at low mains the drain voltage is likely to go below ground. Any risk of injecting the substrate of the IC is prevented by an internal structure surrounding the switch. The gate driver of the power MOSFET is designed to supply a controlled gate current during both turn-on and turn-off in order to minimize common mode EMI. Under UVLO conditions an internal pull-down circuit holds the gate low in order to ensure that the power MOS- FET cannot be turned on accidentally. 17 V DRAIN Vcc 15 M Ω UVLO 150 Ω GND POWER MOSFET |
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