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MPF0900AMMA2ES Datasheet(PDF) 143 Page - NXP Semiconductors |
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MPF0900AMMA2ES Datasheet(HTML) 143 Page - NXP Semiconductors |
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143 / 205 page  NXP Semiconductors PF09 Nine-channel power management IC with advanced system safety monitoring TSNS9 LDO3 aaa-056079 TSNS8 LDO2 TSNS1 Center of die CTAT voltage COMP vtrip_dig TSD* V155C V140C V125C V110C en, vsel<6:0>deltaT TSNS5 SW4 TSNS3 SW2 Digital logic State machine (Thermal interrupt decoding) TSNS7 LDO1 TSNS6 SW5 TSNS4 SW3 TSNS2 SW1 BG Thermal monitoring architecture * TSD is selectable between 165C and 175C Figure 37. Thermal monitoring architecture The central thermal monitoring is always enabled during the RUN state, to allow thermal protection during heavy loading conditions. During the monitored STANDBY state, the thermal monitor operates in sample mode to optimize power utilization without sacrificing thermal monitoring availability. In the Low-power STANDBY and OFF states, the thermal monitoring is disabled allow the system to achieve the lowest power consumption. The PF09 provides four thermal thresholds to notify the system when the die temperature has crossed the respective threshold. Thermal threshold Interrupt bit Mask bit Sense bit 110 °C THERM_110_I THERM_110_M THERM_110_S 125 °C THERM_125_I THERM_125_M THERM_125_S 140 °C THERM_140_I THERM_140_M THERM_140_S 155 °C THERM_155_I THERM_155_M THERM_155_S Table 192. Thermal thresholds notification bits The thermal interrupt will be asserted when the die temp crosses the corresponding threshold on the rising edge, and it will assert the INTB pin as long as the corresponding interrupt is not masked. The MCU can select the thermal warning relevant to the system to take appropriate action to bring down the temperature (either by turning off external regulators, reducing load, or turning on a fan). A thermal shutdown (TSD) threshold is provided to start a shutdown event when the die temperature has crossed the TSD threshold during the RUN and monitored STANDBY states. When the device reaches the thermal shutdown, it will proceed to turn off the power supplies and it won’t be able to restart until the die temperature has decreased below the TSD with a 10 °C hysteresis. During the power-up event, the thermal monitor is used to gate the Power-up sequence if the die temperature is above the thermal shutdown threshold PF09 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 1.3 — 16 December 2025 Document feedback 143 / 205 |
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