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MPF0900AMMA2ES Datasheet(PDF) 188 Page - NXP Semiconductors

Part # MPF0900AMMA2ES
Description  Nine-channel power management IC with advanced system safety monitoring
PDF  205 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPF0900AMMA2ES Datasheet(HTML) 188 Page - NXP Semiconductors

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NXP Semiconductors
PF09
Nine-channel power management IC with advanced system safety monitoring
17 Thermal characteristics
All parameters are specified up to a junction temperature of 150 °C. All parameters are tested at TA from −40 °C to 105
°C, to allow headroom for self-heating during operation. If higher TA operation is required, proper thermal and loading
consideration must be made to ensure device operation below the maximum TJ = 150 °C.
Symbol
Description
Min
Typ
Max
Unit
TA
Ambient operating temperature
-40
–
125
°C
TJ
Junction temperature
-40
–
150
°C
TST
Storage temperature range
-55
–
150
°C
TPPRT
Peak package reflow temperature
–
–
260
°C
Table 234. Thermal characteristics
Symbol
Description
Min
Typ
Max
Unit
RθJA
Junction to Ambient Thermal Resistance[1]
JESD51-7, 2s2p
–
–
24.4
°C/W
ΨJT
Junction-to-Top of Package Thermal Characterization
Parameter[1]
Eight-layer board (4S4P)
–
–
0.2
°C/W
RθJC
Junction to Case Thermal Resistance[2]
JESD51-7, 1s
–
–
1.0
°C/W
Table 235. QFN56 thermal resistance package dissipation ratings
[1]
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
[2]
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2.
When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
PF09
All information provided in this document is subject to legal disclaimers.
© 2026 NXP B.V. All rights reserved.
Product data sheet
Rev. 1.3 — 16 December 2025
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