Handling, PC Board

Layout, and Assembly

The DS1340C package contains a quartz tuning-fork

crystal. Pick-and-place equipment may be used, but

precautions should be taken to ensure that excessive

shocks are avoided. Exposure to reflow is limited to 2

times maximum. Ultrasonic cleaning should be avoided

to prevent damage to the crystal.

Avoid running signal traces under the package, unless

a ground plane is placed between the package and the

signal line. All N.C. (no connect) pins must be connect-

ed to ground.

The leaded 16-pin SO package may be reflowed as

long as the peak temperature does not exceed 240°C.

Peak reflow temperature (≥ 230°C) duration should not

exceed 10 seconds, and the total time above 200°C

should not exceed 40 seconds (30 seconds nominal).

The RoHS and lead-free/RoHS packages may be

reflowed using a reflow profile that complies with

JEDEC J-STD-020.

Moisture-sensitive packages are shipped from the facto-

ry dry-packed.Handling instructions listed on the pack-

age label must be followed to prevent damage during

reflow. Refer to the IPC/JEDEC J-STD-020 standard for

moisture-sensitive device (MSD) classifications.

____________________________________________________________________

13

1

2

3

4

8

7

6

5

FT/OUT

SCL

SDA

GND

X2

X1

TOP VIEW

DS1340

SO, µSOP

DS1340C

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

8

SCL

SDA

GND

N.C.

N.C.

N.C.

N.C.

N.C.

SO (300 mils)

FT/OUT

N.C.

N.C.

N.C.

N.C.

N.C.

Pin Configurations