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PESD4USB3B-TTS Datasheet(PDF) 8 Page - Nexperia B.V. All rights reserved |
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PESD4USB3B-TTS Datasheet(HTML) 8 Page - Nexperia B.V. All rights reserved |
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8 / 11 page ![]() Nexperia PESD4USB3B-TTS ESD protection for high-speed interfaces 11. Soldering SOT1165D Footprint information for reflow soldering of DFN2510D-10 package sot1165d_fr occupied area solder paste solder resist solder land Dimensions in mm Issue date 20-11-27 0.2 0.4 (2x) 0.1 0.5 (2x) 0.3 (8x) 0.2 (8x) 0.3 0.2 1.3 1.45 1.75 0.5 0.5 2.5 2.2 2.8 0.6 (10x) 0.25 0.15 0.7 (10x) recommended stencil thickness: 0.1 mm Fig. 10. Reflow soldering footprint for DFN2510D (SOT1165D) PESD4USB3B-TTS All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2021. All rights reserved Product data sheet 15 March 2021 8 / 11 |
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