Contact

Phone

Gloria Gordon

1-408-721-8435

MSL Rating

Peak Body Temp C

MaxTime (Sec)

Cycles

4

220

30

4

Document Date

Weight (mg)

Unit Type

1-Sep-2007

420.000

Each

Item

Weight (mg)

Component

CAS#

Weight (mg)

Item-ppm

Part-ppm

Plastic

305.050 SiO2

60676-86-0

211.278

692,600

503,042

Epoxy Resin

25928-94-3

85.414

280,000

203,367

Sb2O3

1309-64-4

6.101

20,000

14,526

Brominated Epoxy

40039-93-8

2.257

7,400

5,375

Leadframe

101.910 Cu

7440-50-8

99.311

974,500

236,455

Fe

7439-89-6

2.446

24,000

5,823

Zn

7440-66-6

0.122

1,200

291

P

7723-14-0

0.031

300

73

Ext. LeadFinish

6.350 Sn

7440-31-5

5.398

850,000

12,851

Pb

7439-92-1

0.953

150,000

2,268

Chip

5.350 Si

7440-21-3

5.318

994,000

12,662

Al

7429-90-5

0.032

6,000

76

Die Attach

0.570 Ag

7440-22-4

0.428

750,000

1,018

Epoxy Resin

25928-94-3

0.143

250,000

339

Int. LeadFinish

0.470 Ag

7440-22-4

0.470

1,000,000

1,119

Wires

0.300 Au

7440-57-5

0.300

1,000,000

714

RoHS Directive

2002/95/EC

Gerry Fields

Vice President Quality

Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing.

Additionally, the following should be noted:

1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties.

2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.

Part Number

Homogeneous Material Composition Declaration for Electronic Products

Contains Lead(Pb) and is NOT European RoHS Compliant.

TP3054WMX

NOT China RoHS Compliant

National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information

provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from

default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default

may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations

are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers

consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s

standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in

connection with the information provided herein unless otherwise provided by a written contract signed by both parties.

NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION.

Company

http://www.national.com/quality/green/

URL for Additional Information

Green.project@nsc.com

Email

National Semiconductor

Engineering Project Manager

Title

RoHS Material Composition Declaration

RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent

Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass

(100 PPM) of homogeneous material for Cadmium

Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date.

1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances

2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A

threshold levels, except lead in RoHS exempt applications 5, 7a and 7c.

2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do

not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in

solder and RoHS exempt applications 5, 7a and 7c.

3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for

Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at

www.national.com/quality/green/.

4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that

Deplete the Ozone Layer and U.S. Clean Air Act, Title VI.

National Semiconductor

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