Contact

Phone

Gloria Gordon

1-408-721-8435

MSL Rating

Peak Body Temp C

MaxTime (Sec)

Cycles

1

235

30

4

Document Date

Weight (mg)

Unit Type

29-Dec-2007

70.000

Each

Item

Weight (mg)

Component

CAS#

Weight (mg)

Item-ppm

Part-ppm

Plastic

44.710 SiO2

60676-86-0

36.215

810,000

517,359

Epoxy Resin

25928-94-3

7.243

162,000

103,472

Sb2O3

1309-64-4

0.894

20,000

12,774

Brominated Epoxy

40039-93-8

0.358

8,000

5,110

Leadframe

20.560 Cu

7440-50-8

20.036

974,500

286,225

Fe

7439-89-6

0.493

24,000

7,049

Zn

7440-66-6

0.025

1,200

352

P

7723-14-0

0.006

300

88

Chip

2.360 Si

7440-21-3

2.346

994,000

33,512

Al

7429-90-5

0.014

6,000

202

Ext. LeadFinish

1.840 Sn

7440-31-5

1.564

850,000

22,343

Pb

7439-92-1

0.276

150,000

3,943

Die Attach

0.270 Ag

7440-22-4

0.203

750,000

2,893

Epoxy Resin

25928-94-3

0.068

250,000

964

Int. LeadFinish

0.180 Ag

7440-22-4

0.180

1,000,000

2,571

Wires

0.080 Au

7440-57-5

0.080

1,000,000

1,143

RoHS Directive

2002/95/EC

Gerry Fields

Vice President Quality

Note: The device content disclosed herewith is approximate and is based on engineering estimates only. It has not been verified through analytical testing.

Additionally, the following should be noted:

1. One or more dopant materials may be present in the silicon die at sub-ppm levels to provide semiconductor properties.

2. Epoxy resin components listed are generic and may or may not be the specific compound used, which is considered proprietary.

Part Number

Homogeneous Material Composition Declaration for Electronic Products

Contains Lead(Pb) and is NOT European RoHS Compliant.

TL082CMX

NOT China RoHS Compliant

National has taken commercially reasonable steps to provide representative and accurate information but may not have independently verified information

provided by others or conducted testing or chemical analysis on incoming materials and chemicals. Information provided in this document is derived from

default values associated with internal process information and may not be representative of all or actual materials used in the product (e.g. the default

may indicate a particular material, while an equivalent compliant material from the same or alternate supplier was actually used). Material concentrations

are the maximum expected concentration of the substances in the device and may not represent the actual concentration. National and National suppliers

consider certain limited information to be confidential and thus CAS numbers and other limited information may not be available for release. National’s

standard warranty and limitation of liability provisions of National’s Standard Terms and Conditions of Sale apply to any issues arising out of or in

connection with the information provided herein unless otherwise provided by a written contract signed by both parties.

NATIONAL ACCEPTS NO DUTY TO NOTIFY USERS OF THIS DECLARATION OF UPDATES OR CHANGES TO THIS DECLARATION.

Company

http://www.national.com/quality/green/

URL for Additional Information

Green.Project@nsc.com

Email

National Semiconductor

Engineering Project Manager

Title

RoHS Material Composition Declaration

RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent

Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass

(100 PPM) of homogeneous material for Cadmium

Subject to the limitations below, National Semiconductor Corporation (“National”) certifies the following information as of the document date.

1. National products with lead-free solder comply with the European Union’s Directive on the Restriction of the Use of Hazardous Substances

2002/95/EC (“RoHS”). These products do not contain homogeneous materials with Joint Industry Guide (JIG) -101 Level A materials above Level A

threshold levels, except lead in RoHS exempt applications 5, 7a and 7c.

2. National products with lead-containing solder do not comply with RoHS, because they contain lead in a non-exempt application. These products do

not contain other RoHS restricted substances or homogeneous materials with JIG-101 Level A materials above Level A threshold levels, except lead in

solder and RoHS exempt applications 5, 7a and 7c.

3. National products are manufactured in conformance with National specifications (SC) CSP-9-111C1 Supplier Environmental Requirements for

Materials and Products and (SC) CSP-9-111S2 National’s List of Banned and Reportable Substances, which are available at

www.national.com/quality/green/.

4. National products do not contain and are not manufactured with ozone depleting substances subject to The Montreal Protocol on Substances that

Deplete the Ozone Layer and U.S. Clean Air Act, Title VI.

National Semiconductor

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