EMIF08-1502M16

Recommendation on PCB assembly

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4

Recommendation on PCB assembly

4.1

Stencil opening design

1.

General recommendation on stencil opening design

a)

Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 12.

Stencil opening dimensions

b)

General design rule

Stencil thickness (T) = 75 ~ 125 µm

2.

Reference design

a)

Stencil opening thickness: 100 µm

b)

Stencil opening for central exposed pad: Opening to footprint ratio is 50%.

c)

Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 13.

Recommended stencil window position

L

T

W

Aspect Ratio

W

T

-----

1.5

≥

=

Aspect Area

LW

×

2T L

W

+

()

----------------------------

0.66

≥

=

200 µm

190 µm

15 µm

15 µm

5µm

5µm

2600 µm

350 µm

1820 µm

390 µm

390 µm

50 µm

50 µm

Footprint

Stencil window

Footprint

0.40

0.60

0.35

0.20

2.60

0.275