M25P80-VMP6TP datasheet(50/52 Pages) NUMONYX

50 / 52 page

Revision history

M25P80

50/52

Revision history

Table 21.

Document revision history

Date

Revision

Changes

24-Apr-2002

1.0

Document released as a Product Preview data sheet

Clarification of descriptions of entering Standby Power mode from Deep

Power-down mode, and of terminating an instruction sequence or data-out

sequence.

27-Sep-2002

1.1

VFQFPN8 package (MLP8) added. Order code (MW) corrected on page 1

for SO8 package. Document promoted to Preliminary Data.

13-Dec-2002

1.2

Typical Page Program time improved. Write Protect setup and hold times

specified, for applications that switch Write Protect to exit the Hardware

Protection mode immediately before a WRSR, and to enter the Hardware

Protection mode again immediately after.

24-Oct-2003

2.0

Table of contents, warning about exposed paddle on MLP8, and Pb-free

options added.

40MHz AC Characteristics table included as well as 25MHz. Change of

naming for VDFPN8 package. Document promoted to full datasheet

24-Nov-2003

2.1

Improvement to description of reading the 8-bit electronic signature.

21-Apr-2004

3.0

SO16 package added. SO8W package removed. Soldering temperature

information clarified for RoHS compliant devices. Device Grade clarified

07-May-2004

4.0

Automotive range added

18-May-2004

5.0

SO8W package re-instated, but under limited availability

05-Aug-2004

6.0

Data-retention measurement temperature corrected. Details of how to find

the date of marking added.

01-Aug-2005

7.0

Updated Page Program (PP) instructions in Page Programming, Page

Program (PP), Instruction times and Instruction Times (Device Grade 3).

20-Oct-2005

8.0

SO16 package removed. All packages are ECOPACK®. MLP8 package

renamed as VFQFPN8. Plating technology clarified in Table 20: Ordering

information scheme. VFQFPN silhouette modified (see silhouette on page

1). tSHQZ timing modified in Figure 25: Output timing.

13-Apr-2006

Device grade 3 specifications removed from datasheet. Data retention

conditions changed in Table 11: Data retention and endurance.

Figure 3: Bus Master and memory devices on the SPI bus modified and

Note 2 added.

Note 2 added below Figure 26 and Note 2 added below Figure 27.

Note on SO8 package removed below Table 20: Ordering information

scheme.

20-Jul-2006

SO8N package added (see Figure 28 and Table 19).

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