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AT25DF011 Datasheet(PDF) 45 Page - Renesas Technology Corp

Part # AT25DF011
Description  1-Mbit, 1.65 V Minimum SPI Serial Flash Memory with Dual-Read Support
PDF  50 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

AT25DF011 Datasheet(HTML) 45 Page - Renesas Technology Corp

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DS-AT25DF011-032 Rev. J
Page 45
2023-11-14
© 2023 Renesas Electronics
AT25DF011 Datasheet
16. Ordering Information
1. The shipping carrier option code is not marked on the devices.
2. Contact Renesas Electronics for mechanical drawing or Die Sales information.
Ordering Code 1
Package
Lead
Finish
Max. Freq.
(MHz)
Operating Voltage /
Temperature Range
AT25DF011-SSHN-B
AT25DF011-SSHN-T
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline
Package (JEDEC SOIC)
NiPdAu
104
Industrial
1.65 V to 3.6 V
(-40 °C to +85 °C)
AT25DF011-MAHN-T
8-pad, 2 x 3 x 0.6 mm, Thermally Enhanced Plastic
Ultra Thin Dual Flat No Lead Package (UDFN)
AT25DF011-XMHN-B
AT25DF011-XMHN-T
8-lead, Thin Small Outline Package
AT25DF011-DWF 2
Die in Wafer Form
N/A
AT25DF011-SSHNHR-T
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline
Package (JEDEC SOIC)
NiPdAu
Extended
1.70 V to 3.6 V /
(-40 °C to +125 °C)
AT25DF011-XMHNHR-T
8-lead, Thin Small Outline Package
AT25DF011-XMHNHR-B
AT25DF011-MAHNHR-T
8-pad, 2 x 3 x 0.6 mm, Thermally Enhanced Plastic
Ultra Thin Dual Flat No Lead Package (UDFN)
AT25DF011-DWFHT 2
Die in Wafer Form
N/A
A T 2 5 D
0 1
S S H
T
1–
–
F
Designator
Product Family
Device Density
011 = 1-megabit
Package Option
SS = 8-lead, 0.150" wide SOIC
MA = 8-pad, 2 x 3 x 0.6 mm UDFN
XM = 8-lead TSSOP
DWF = Die in Wafer Form
Device Grade
H = Green, NiPdAu lead finish
Shipping Carrier Option
B = Bulk (tubes)
T = Tape and reel
N HR
Operating Voltage
blank or N = 1.65 V to 3.6 V or 1.7 V to 3.6 V
Temperature Code
HR, HT = -40 °C to +125 °C
blank = -40 °C to +85 °C



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