Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

SN74ALS654NTE4

ACTIVE

PDIP

NT

24

15

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74AS651DW

OBSOLETE

SOIC

DW

24

TBD

Call TI

Call TI

SN74AS651DWR

OBSOLETE

SOIC

DW

24

TBD

Call TI

Call TI

SN74AS651NT

OBSOLETE

PDIP

NT

24

TBD

Call TI

Call TI

SN74AS652DW

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74AS652DWE4

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74AS652DWG4

ACTIVE

SOIC

DW

24

25

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74AS652DWR

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74AS652DWRE4

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74AS652DWRG4

ACTIVE

SOIC

DW

24

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74AS652NT

ACTIVE

PDIP

NT

24

15

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SN74AS652NTE4

ACTIVE

PDIP

NT

24

15

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

SNJ54ALS652FK

ACTIVE

LCCC

FK

28

1

TBD

POST-PLATE

N / A for Pkg Type

SNJ54ALS652JT

ACTIVE

CDIP

JT

24

1

TBD

A42 SNPB

N / A for Pkg Type

SNJ54ALS652W

OBSOLETE

CFP

W

24

TBD

Call TI

Call TI

SNJ54ALS653FK

ACTIVE

LCCC

FK

28

1

TBD

POST-PLATE

N / A for Pkg Type

SNJ54ALS653JT

ACTIVE

CDIP

JT

24

1

TBD

A42 SNPB

N / A for Pkg Type

SNJ54ALS653W

ACTIVE

CFP

W

24

1

TBD

A42

N / A for Pkg Type

SNJ54AS651JT

OBSOLETE

CDIP

JT

24

TBD

Call TI

Call TI

SNJ54AS652FK

ACTIVE

LCCC

FK

28

1

TBD

POST-PLATE

N / A for Pkg Type

SNJ54AS652JT

ACTIVE

CDIP

JT

24

1

TBD

A42 SNPB

N / A for Pkg Type

SNJ54AS652W

ACTIVE

CFP

W

24

1

TBD

A42

N / A for Pkg Type

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

PACKAGE OPTION ADDENDUM

www.ti.com

9-Oct-2007

Addendum-Page 3