M27V160 datasheet(5/15 Pages) STMICROELECTRONICS

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M27V160

Table 7. Read Mode DC Characteristics (1)

(TA = 0 to 70°C or –40 to 85°C; VCC = 3.3V ± 10%; VPP =VCC)

Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

2. Maximum DC voltage on Output is VCC +0.5V.

Symbol

Parameter

Test Condition

Min

Max

Unit

ILI

Input Leakage Current

≤ VIN ≤ VCC

±1

µA

ILO

Output Leakage Current

≤ VOUT ≤ VCC

±10

µA

ICC

Supply Current

E=VIL,G= VIL,IOUT = 0mA,

f = 8MHz, VCC ≤ 3.6V

E=VIL,G= VIL,IOUT = 0mA,

f = 5MHz, VCC ≤ 3.6V

ICC1

Supply Current (Standby) TTL

E= VIH

1mA

ICC2

Supply Current (Standby) CMOS

E> VCC –0.2V, VCC ≤ 3.6V

µA

IPP

Program Current

VPP =VCC

µA

VIL

Input Low Voltage

–0.3

0.2VCC

VIH

(2)

Input High Voltage

0.7VCC

VCC +1

VOL

Output Low Voltage

IOL = 2.1mA

0.4

VOH

Output High Voltage TTL

IOH = –400µA

2.4

System Considerations

The power switching characteristics of Advanced

CMOS EPROMs require careful decoupling of the

supplies to the devices. The supply current ICC

has three segments of importance to the system

designer: the standby current, the active current

and the transient peaks that are produced by the

falling and rising edges of E. The magnitude of the

transient current peaks is dependent on the ca-

pacitive and inductive loading of the device out-

puts. The associated transient voltage peaks can

be suppressed by complying with the two line out-

put control and by properly selected decoupling

capacitors. It is recommended that a 0.1

µF ceram-

ic capacitor is used on every device between VCC

and VSS. This should be a high frequency type of

low inherent inductance and should be placed as

close as possible to the device. In addition, a

4.7

µF electrolytic capacitor should be used be-

tween VCC and VSS for every eight devices. This

capacitor should be mounted near the power sup-

ply connection point. The purpose of this capacitor

is to overcome the voltage drop caused by the in-

ductive effects of PCB traces.

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