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59112 Datasheet(PDF) 12 Page - Amphenol Communications Solutions

Part # 59112
Description  Minitek® Crimp-to-Wire
PDF  15 Pages
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Manufacturer  AMPHENOLCS [Amphenol Communications Solutions]
Direct Link  https://www.amphenol-cs.com/
Logo AMPHENOLCS - Amphenol Communications Solutions

59112 Datasheet(HTML) 12 Page - Amphenol Communications Solutions

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Disclaimer
Please note that the above information is subject to change without notice.
Minitek® Headers
PIN-IN-PASTE
Pin-in-Paste (PiP) technology allows the use of TMT products in SMT manufacturing processes. The connectors are
automatically or manually placed on the board, then soldered in the same operations the SMT components. Despite this,
the mechanical strength of the TMT soldering is maintained – still an important requirement for connectors nowadays in
many industrial or automotive applications.
PLASTIC MATERIAL
Minitek® PIP headers are molded in high temperature
thermoplastic and are able to withstand exposure to
260°C peak temperature for 30 seconds maximum in a
convection, infra-red or vapour phase re-flow oven.
PIN LENGTH
The connector lead length beyond the bottom of the PCB
is shorter than for traditional TMT products. Thus, the risk
of pushing out the solder paste when inserting the pin
into the PCB hole is very much limited. The solder paste
will not stick on the pin tip or even fall off completely,
but stays around the pin for free flow during soldering.
Amphenol FCI uses a solder tail length of 2 ± 0.2mm for
Minitek® Headers for a standard PCB of 1.6mm thickness.
CONNECTOR DESIGN
In order to achieve optimum soldering results, Amphenol FCI launches dedicated Pin-in-Paste connectors in the basics+
product range. These connectors are fully adapted to Pin-in-Paste processing in all aspects, including plastic material,
housing design, pin length, and packaging.
HOUSING DESIGN
Standoffs raise the housing body slightly above the PCB
surface and thus allow the molten solder paste to flow
freely from its printed position into the board hole and
around the pin. The standoffs are correctly positioned for
a good solder paste deposit around the pin. Please respect
the stencil design guidelines below in order to avoid paste
deposit around the standoffs.
PACKAGING
For combining SMT and TMT components not only in
the soldering process, but also in the assembly process,
Amphenol FCI proposes a choice of pick-and-place
packaging for PIP connectors. The most common part
numbers are available in tape-on-reel packaging, all
others in tube.
SHROUDED



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