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59112 Datasheet(PDF) 12 Page - Amphenol Communications Solutions |
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59112 Datasheet(HTML) 12 Page - Amphenol Communications Solutions |
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12 / 15 page ![]() www.amphenol-cs.com Disclaimer Please note that the above information is subject to change without notice. Minitek® Headers PIN-IN-PASTE Pin-in-Paste (PiP) technology allows the use of TMT products in SMT manufacturing processes. The connectors are automatically or manually placed on the board, then soldered in the same operations the SMT components. Despite this, the mechanical strength of the TMT soldering is maintained – still an important requirement for connectors nowadays in many industrial or automotive applications. PLASTIC MATERIAL Minitek® PIP headers are molded in high temperature thermoplastic and are able to withstand exposure to 260°C peak temperature for 30 seconds maximum in a convection, infra-red or vapour phase re-flow oven. PIN LENGTH The connector lead length beyond the bottom of the PCB is shorter than for traditional TMT products. Thus, the risk of pushing out the solder paste when inserting the pin into the PCB hole is very much limited. The solder paste will not stick on the pin tip or even fall off completely, but stays around the pin for free flow during soldering. Amphenol FCI uses a solder tail length of 2 ± 0.2mm for Minitek® Headers for a standard PCB of 1.6mm thickness. CONNECTOR DESIGN In order to achieve optimum soldering results, Amphenol FCI launches dedicated Pin-in-Paste connectors in the basics+ product range. These connectors are fully adapted to Pin-in-Paste processing in all aspects, including plastic material, housing design, pin length, and packaging. HOUSING DESIGN Standoffs raise the housing body slightly above the PCB surface and thus allow the molten solder paste to flow freely from its printed position into the board hole and around the pin. The standoffs are correctly positioned for a good solder paste deposit around the pin. Please respect the stencil design guidelines below in order to avoid paste deposit around the standoffs. PACKAGING For combining SMT and TMT components not only in the soldering process, but also in the assembly process, Amphenol FCI proposes a choice of pick-and-place packaging for PIP connectors. The most common part numbers are available in tape-on-reel packaging, all others in tube. SHROUDED |
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