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ABP Datasheet(PDF) 3 Page - Honeywell Solid State Electronics Center |
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ABP Datasheet(HTML) 3 Page - Honeywell Solid State Electronics Center |
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3 / 14 page ![]() 3 sensing.honeywell.com General Specifications Table 1. Absolute Maximum Ratings1 Characteristic Min. Max. Unit Supply voltage (V supply) -0.3 6.0 Vdc Voltage on any pin -0.3 V supply + 0.3 V Digital interface clock frequency: I2C SPI 100 50 400 800 kHz ESD susceptibility (human body model) 2 — kV Storage temperature -40 [-40] 85 [185] °C [°F] Soldering time and temperature: lead solder temperature (DIP) peak reflow temperature (Leadless SMT, SMT) 4 s max. at 250 °C [482 °F] 15 s max. at 250 °C [482 °F] 1 Absolute maximum ratings are the extreme limits the device will withstand without damage. Table 2. Environmental Specifications Characteristic Parameter Humidity (Gases only; see “Options N and D” in Figure 2.) 0% to 95% RH, non-condensing Vibration 15 g, 10 Hz to 2 kHz Shock 100 g, 6 ms duration Life1 1 million pressure cycles minimum Solder reflow J-STD-020-D.1 Moisture Sensitivity Level 1 (unlimited shelf life when stored at <30 °C/85 % RH) 1 Life may vary depending on specific application in which the sensor is used. Table 4. Sensor Pressure Types Pressure Type Description Gage Output is proportional to the difference between applied pressure and atmospheric (ambient) pressure. Differential Output is proportional to the difference between the pressures applied to each port (Port 1 – Port 2). Table 3. Wetted Materials1 Component Pressure Port No SIlicone Gel Coating Option Silicone Gel Coating Option Ports and covers high temperature polyamide Substrate alumina ceramic NOTnot exposed; protected by silicone gel Adhesives epoxy, silicone epoxy Electronic components ceramic, silicon, glass, solder, gold not exposed; protected by silicone gel 1 Contact Honeywell Customer Service for detailed material information. |
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