R8152S041B datasheet(13/28 Pages) NISSHINBO

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R8152x

NO. EC-238-180730

5000

4000

3000

2000

100 125 150

Ambient Temperature (

C)

Power Dissipation

On Board

(Ultra High Wattage Land Pattern)

2350

4800

On Board

(Standard Land Pattern)

POWER DISSIPATION (TO-252-5-P2)

Power Dissipation (PD) depends on conditions of mounting on board.

This specification is based on the measurement at the condition below:

* Measurement conditions

Standard Land Pattern

Ultra High Wattage Land Pattern

Environment

Mounting on board (Wind velocity 0 m/s)

Board Material

Glass cloth epoxy plastic

(Double layers)

Glass cloth epoxy plastic

(Four-layers)

Board Dimensions

50 mm x 50 mm x 1.6 mm

76.2 mm x 114.3 mm x 0.8 mm

Copper Ratio

Top side: Approx. 50%,

Back side: Approx. 50%

Top, Back side: Approx. 96%,

2nd, 3rd: 100%

Through - hole

 0.5 mm x 24 pcs

 0.4 mm x 30 pcs

* Measurement Results

(Ta = 25°C, Tjmax = 150°C)

Standard Land Pattern

Ultra High Wattage Land Pattern

Power Dissipation

2350 mW

4800 mW

Thermal Resistance

ja = (150 - 25°C)/2.35 W = 53°C/W

ja = (150 - 25°C)/4.8 W =

26°C/W

jc = 17°C/Wjc = 7°C/W

Standard

76.2

Ultra High Wattage

Measurement Board Pattern

IC Mount Area (Unit: mm)

R8152S041B Datasheet(PDF) 13 Page - Nisshinbo Micro Devices Inc.

R8152S041B Datasheet(HTML) 13 Page - Nisshinbo Micro Devices Inc.

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