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DMNH6009SPS-13 Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMNH6009SPS-13 Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 9 page ![]() DMNH6009SPS Document number: DS41482 Rev. 3 - 2 2 of 9 www.diodes.com March 2020 © Diodes Incorporated DMNH6009SPS Ordering Information (Note 4) Part Number Case Packaging DMNH6009SPS-13 PowerDI5060-8/ PowerDI5060-8 (SWP) (Type UX) 2500/Tape & Reel Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied. 2. See https://www.diodes.com/quality/lead- free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony- free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. Marking Information Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 60 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current (Note 7) VGS = 10V TC = +25°C TC = +100°C ID 95 67 A Pulsed Drain Current (380µs Pulse, Duty Cycle = 1%) IDM 380 A Maximum Continuous Body Diode Forward Current (Note 7) IS 95 A Pulsed Source Current (380µs Pulse, Duty Cycle = 1%) ISM 380 A Avalanche Current, L = 0.1mH (Note 8) IAS 56 A Avalanche Energy, L = 0.1mH (Note 8) EAS 226 mJ Thermal Characteristics Characteristic Symbol Value Unit Total Power Dissipation (Note 5) PD 1.6 W Thermal Resistance, Junction to Ambient (Note 5) Steady State RθJA 95 °C/W Total Power Dissipation (Note 6) PD 3.3 W Thermal Resistance, Junction to Ambient (Note 6) Steady State RθJA 46 °C/W Thermal Resistance, Junction to Case (Note 7) RθJC 1.5 Operating and Storage Temperature Range TJ, TSTG -55 to +175 °C Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PCB, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 7. Thermal resistance from junction to soldering point (on the exposed drain pad). 8. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C. = Manufacturer ’s Marking NH6009SS = Product Type Marking Code YYWW = Date Code Marking YY or YY= Last Two Digits of Year (ex: 20 = 2020) WW = Week Code (01 to 53) |
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