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ISO6040HDFPR Datasheet(PDF) 40 Page - Texas Instruments |
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ISO6040HDFPR Datasheet(HTML) 40 Page - Texas Instruments |
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40 / 51 page  www.ti.com EXAMPLE BOARD LAYOUT (9.85) R0.05 TYP 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND (9.3) 14X (1.27) R0.05 TYP 16X (1.65) 16X (0.6) 14X (1.27) (8.2) 16X (2) 16X (0.6) (7.3) 4231632/A 02/2025 SYMM SOIC - 2.55 mm max height DW0016C-C01 SMALL OUTLINE INTEGRATED CIRCUIT SYMM SEE DETAILS 1 8 9 16 SYMM HV / ISOLATION OPTION 8.2 mm CLEARANCE/CREEPAGE NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS EXPOSED METAL OPENING SOLDER MASK METAL SOLDER MASK DEFINED EXPOSED METAL EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE:4X SYMM 1 8 9 16 IPC-7351 NOMINAL 7.3 mm CLEARANCE/CREEPAGE SEE DETAILS ISO6041 SLLSFV3A – DECEMBER 2025 – REVISED MARCH 2026 www.ti.com 40 Submit Document Feedback Copyright © 2026 Texas Instruments Incorporated Product Folder Links: ISO6041 |
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